Multiprocessing implementations for time-dependent fracture analysis of an electronic packaging structure

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dc.contributor.authorSaribay, Murat
dc.date.accessioned2024-07-18T20:42:22Z
dc.date.available2024-07-18T20:42:22Z
dc.date.issued2023
dc.departmentİstanbul Bilgi Üniversitesien_US
dc.description.abstractInvestigation of fracture mechanics problems with computational tools has always been a great challenge due to singularities present at the crack tip. FRAC3D is an effective finite element tool that benefits from enriched element methodology. The dynamic version of this code enables the analysis of structures with stationary cracks subjected to impact loading. Response of the components in these problems are highly influenced by stress wave propagation phenomenon. In this study, bimaterial interface cracking in an electronic packaging structure is analyzed considering transient behavior. Besides the complications associated with the finite element solution of such a problem, long computational times may also be an issue considering model sizes. Multiprocessing of finite element codes could save significant times if corresponding algorithms are restructured with parallel processing tools in an efficient form. Up to 75 % reductions in time for the given example were obtained by using newly implemented multiprocessing code.en_US
dc.identifier.doi10.1007/s12206-023-0510-x
dc.identifier.endpage2841en_US
dc.identifier.issn1738-494X
dc.identifier.issn1976-3824
dc.identifier.issue6en_US
dc.identifier.scopus2-s2.0-85160866292en_US
dc.identifier.scopusqualityQ2en_US
dc.identifier.startpage2831en_US
dc.identifier.urihttps://doi.org/10.1007/s12206-023-0510-x
dc.identifier.urihttps://hdl.handle.net/11411/7260
dc.identifier.volume37en_US
dc.identifier.wosWOS:001002641600010en_US
dc.identifier.wosqualityN/Aen_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherKorean Soc Mechanical Engineersen_US
dc.relation.ispartofJournal of Mechanical Science and Technologyen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectDynamic Fractureen_US
dc.subjectElectronic Packaging Structureen_US
dc.subjectInterface Fractureen_US
dc.subjectParallel Programmingen_US
dc.subjectWave Propagationen_US
dc.subjectStress Intensity Factorsen_US
dc.subjectMechanicsen_US
dc.subjectBgaen_US
dc.titleMultiprocessing implementations for time-dependent fracture analysis of an electronic packaging structureen_US
dc.typeArticleen_US

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