Multiprocessing implementations for time-dependent fracture analysis of an electronic packaging structure
Küçük Resim Yok
Tarih
2023
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Korean Soc Mechanical Engineers
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
Investigation of fracture mechanics problems with computational tools has always been a great challenge due to singularities present at the crack tip. FRAC3D is an effective finite element tool that benefits from enriched element methodology. The dynamic version of this code enables the analysis of structures with stationary cracks subjected to impact loading. Response of the components in these problems are highly influenced by stress wave propagation phenomenon. In this study, bimaterial interface cracking in an electronic packaging structure is analyzed considering transient behavior. Besides the complications associated with the finite element solution of such a problem, long computational times may also be an issue considering model sizes. Multiprocessing of finite element codes could save significant times if corresponding algorithms are restructured with parallel processing tools in an efficient form. Up to 75 % reductions in time for the given example were obtained by using newly implemented multiprocessing code.
Açıklama
Anahtar Kelimeler
Dynamic Fracture, Electronic Packaging Structure, Interface Fracture, Parallel Programming, Wave Propagation, Stress Intensity Factors, Mechanics, Bga
Kaynak
Journal of Mechanical Science and Technology
WoS Q Değeri
N/A
Scopus Q Değeri
Q2
Cilt
37
Sayı
6
