Silicone Mold Implementation for High-Sensitive Detection of Strain Sensing using Paper-Based Piezoresistive System

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dc.authoridKorkut, Dogukan/0000-0001-6914-7404
dc.authorwosidBaran, Eray/U-3499-2019
dc.contributor.authorKorkut, Dogukan
dc.contributor.authorErdi, Kuter
dc.contributor.authorAkcan, O. Gokalp
dc.contributor.authorMuslu, Batin
dc.contributor.authorBaran, Eray A.
dc.contributor.authorGokdel, Y. Daghan
dc.date.accessioned2024-07-18T20:51:08Z
dc.date.available2024-07-18T20:51:08Z
dc.date.issued2020
dc.departmentİstanbul Bilgi Üniversitesien_US
dc.description2nd IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) -- AUG 16-19, 2020 -- ELECTR NETWORKen_US
dc.description.abstractThis paper presents the design, fabrication, experimental results and related discussion of a portable bending enhancing silicone mold structure for biomedical applications in which a high-sensitive but low-cost force measurement structure with a large-dynamic range is required. Proposed system is composed of a replaceable parts like graphite coated Strathmore (R) 400 series Bristol paper and cheap RTV-2 silicone molds. The results shows that low-cost, portable and high-sensitive force and strain sensor systems can be realized for point-of-care biomedical applications in the future.en_US
dc.description.sponsorshipIEEE,IEEE Sensor Council,Huawei,Armen_US
dc.identifier.isbn978-1-7281-5278-3
dc.identifier.scopus2-s2.0-85099538028en_US
dc.identifier.scopusqualityN/Aen_US
dc.identifier.urihttps://hdl.handle.net/11411/8412
dc.identifier.wosWOS:000934732700037en_US
dc.identifier.wosqualityN/Aen_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.relation.ispartof2020 Ieee International Conference on Flexible and Printable Sensors and Systems (Ieee Fleps 2020)en_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectPiezoresistive Strain Gaugeen_US
dc.subjectSilicone Molden_US
dc.subjectPaper Substrateen_US
dc.subjectReadout Circuitryen_US
dc.subjectSensoren_US
dc.titleSilicone Mold Implementation for High-Sensitive Detection of Strain Sensing using Paper-Based Piezoresistive Systemen_US
dc.typeConference Objecten_US

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