Environmental sensitivity of printed circuit board manufacturing to Cu recycling rate, transportation and various energy sources

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dc.authoridElginoz, Nilay/0000-0001-6635-6163|Babuna, Fatos Germirli/0000-0003-0365-2373|BAS, Bilge/0000-0002-6273-9527
dc.authorwosidElginoz, Nilay/N-9453-2013
dc.authorwosidBas, Bilge/AAH-2190-2021
dc.authorwosidBabuna, Fatos Germirli/ABB-1571-2020
dc.contributor.authorOzkan, Elif
dc.contributor.authorBas, Bilge
dc.contributor.authorElginoz, Nilay
dc.contributor.authorBabuna, Fatos Germirli
dc.date.accessioned2024-07-18T20:54:21Z
dc.date.available2024-07-18T20:54:21Z
dc.date.issued2020
dc.departmentİstanbul Bilgi Üniversitesien_US
dc.description.abstractThis study concentrates on environmental impacts of PCB manufacturing. The objective is to examine the effect of Cu recycling rate, transportation, energy sources and end-of-life (EoL) on global warming potential (GWP), marine aquatic ecotoxicity potential (MAEP), terrestric ecotoxicity potential (TETP), freshwater aquatic ecotoxicity potential (FAETP), human toxicity potential (HTP), ozone layer depletion (ODP), photochemical ozone creation potential (POCP), eutrophication potential (EP), acidification potential (AP) and abiotic depletion potential (ADP fossil, ADP elements) potentials. Increasing Cu recycling rate from 30% to 47%, reduce the impacts by 10 to 103%. The most significant reduction is for HTP. Transportation elevates AP and POCP by 29%, ADP fossil by 23% and GWP by 21%. Obtaining energy from renewable sources causes 56, 40 and 39% reductions in HTP, ADP fossil and GWP, namely. Apart from GWP where PCB manufacturing and EoL has equal impacts, for the other categories PCB manufacturing has more than 75% contribution.en_US
dc.identifier.endpage248en_US
dc.identifier.issn1758-2083
dc.identifier.issn1758-2091
dc.identifier.issue3en_US
dc.identifier.scopus2-s2.0-85083901125en_US
dc.identifier.scopusqualityQ3en_US
dc.identifier.startpage237en_US
dc.identifier.urihttps://hdl.handle.net/11411/8711
dc.identifier.volume20en_US
dc.identifier.wosWOS:000528678000004en_US
dc.identifier.wosqualityQ4en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherInderscience Enterprises Ltden_US
dc.relation.ispartofInternational Journal of Global Warmingen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectPrinted Circuit Boarden_US
dc.subjectPcben_US
dc.subjectLife Cycle Assessmenten_US
dc.subjectManufacturingen_US
dc.subjectElectronics İndustryen_US
dc.subjectCu Recyclingen_US
dc.subjectTransportationen_US
dc.subjectEnergy Sourceen_US
dc.subjectRecoveryen_US
dc.subjectCopperen_US
dc.titleEnvironmental sensitivity of printed circuit board manufacturing to Cu recycling rate, transportation and various energy sourcesen_US
dc.typeArticleen_US

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